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Micro Systems Technology
Microsystems Technology
Last Updated: 2026-02-05 14:55:37
Objective
Students are introduced to the basics of micromachining and silicon process technology and will understand the formation of microsystem devices by the combination of these process steps, i.e. process flow.
Content
Introduction to microsystems technology (MST) and micro electro mechanical systems (MEMS). Basic silicon technologies: thermal oxidation, photolithography and etching, diffusion and ion implantation, thin film deposition. Specific microsystem technologies: bulk and surface micromachining, dry and wet etching, isotropic and anisotropic etching, beam and membrane formation, wafer bonding, thin film mechnical and thermal properties, piezoelectric and piezoresitive materials. Selected microsystems: mechanical sensors and actuators, microresonators, thermal sensors and actuators,system integration and encapsulation.
Resources
Lecture Notes
Handouts.
Literature
- W. Menz, J. Mohr, O. Paul: Microsystem Technology. - G. Kovacs: Micromachined Transducer Sourcebook.
General Information
- Language
- German
- Frequency
- Yearly recurring
Examination
- Type
- session examination
- Mode
- oral 30 minutes
Course Components
| Type | Title | Time & Place | Hours |
|---|---|---|---|
| lecture with exercise | Microsystems Technology |
|
4 h weekly |