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Microsystem Technology
Microsystems Technology
Last Updated: 2026-02-05 15:02:50
Abstract
Students are introduced to the basics of micromachining and silicon process technology and will learn about the fabrication of microsystems and -devices by a sequence of defined processing steps (process flow).
Objective
Students are introduced to the basics of micromachining and silicon process technology and will understand the fabrication of microsystem devices by the combination of unit process steps ( = process flow).
Content
- Introduction to microsystems technology (MST) and micro electro mechanical systems (MEMS) - Basic silicon technologies: Thermal oxidation, photolithography and etching, diffusion and ion implantation, thin film deposition. - Specific microsystems technologies: Bulk and surface micromachining, dry and wet etching, isotropic and anisotropic etching, beam and membrane formation, wafer bonding, thin film mechanical and thermal properties, piezoelectric and piezoresitive materials. - Selected microsystems: Mechanical sensors and actuators, microresonators, thermal sensors and actuators, system integration and encapsulation.
Resources
Lecture Notes
Handouts
Literature
- S.M. Sze: Semiconductor Devices, Physics and Technology. - W. Menz, J. Mohr, O. Paul: Microsystem Technology. - G. Kovacs: Micromachined Transducer Sourcebook.
General Information
- Language
- English
- Frequency
- Yearly recurring
Examination
- Type
- session examination
- Mode
- oral 30 minutes
Course Components
| Type | Title | Time & Place | Hours |
|---|---|---|---|
| lecture with exercise | Microsystems Technology |
|
4 h weekly |
Offered In
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6. Semester (Die Studierenden im MS-Programm haben freie Auswahl aus dem Angebot der Kernfächer)
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