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Abstract
This course gives an introduction into the fundamentals of semiconductor materials. The main focus in this semester is on state-of-the-art characterization, semiconductor processing and devices.
Objective
Basic knowledge of semiconductor physics and technology. Application of this knowledge for state-of-the-art semiconductor device processing
Content
1. Material characterization: structural and chemical methods 1.1 X-ray diffraction methods (Powder diffraction, HRXRD, XRR, RSM) 1.2 Electron microscopy Methods (SEM, EDX, TEM, STEM, EELS) 1.3 SIMS, RBS 2. Material characterization: electronic methods 2.1 van der Pauw technique 2.2 Hall effect 2.3 Cyclotron resonance spectroscopy 2.4. Quantum Hall effect 3. Material characterization: Optical methods 3.1 Absorption methods 3.2 Photoluminescence methods 3.3 FTIR, Raman spectroscopy 4. Semiconductor processing: lithography 4.1 Optical lithography methods 4.2 Electron beam lithography 4.3 FIB lithography 4.4 Scanning probe lithography 4.5 Direct growth methods (CEO, Nanowires) 5. Semiconductor processing: structuring of layers and devices 5.1 Wet etching methods 5.2 Dry etching methods (RIE, ICP, ion milling) 5.3 Physical vapor depositon methods (thermal, e-beam, sputtering) 5.4 Chemical vapor Deposition methods (PECVD, LPCVD, ALD) 5.5 Cleanroom basics & tour 6. Semiconductor devices 6.1 Semiconductor lasers 6.2 LED & detectors 6.3 Solar cells 6.4 Transistors (FET, HBT, HEMT)
Resources
Lecture Notes
https://moodle-app2.let.ethz.ch/course/view.php?id=27582