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151-0621-00L 6 Credits BSC , DR , MSC D-HEST , D-MAVT , D-PHYS , D-ITET , D-MATL
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Microsystems I: Process Technology and Integration

Lecturers & Examiners: Prof. Dr. Christofer Hierold, Dr. Miroslav Haluska
VVZ CR 4.4

Last Updated: 2026-06-01 11:30:43

Abstract

Students are introduced to the fundamentals of semiconductors, the basics of micromachining and silicon process technology and will learn about the fabrication of microsystems and -devices by a sequence of defined processing steps (process flow).

Objective

Students are introduced to the basics of micromachining and silicon process technology and will understand the fabrication of microsystem devices by the combination of unit process steps ( = process flow).

Content

- Introduction to microsystems technology (MST) and micro electro mechanical systems (MEMS) - Basic silicon technologies: Thermal oxidation, photolithography and etching, diffusion and ion implantation, thin film deposition. - Specific microsystems technologies: Bulk and surface micromachining, dry and wet etching, isotropic and anisotropic etching, beam and membrane formation, wafer bonding, thin film mechanical properties. Application of selected technologies will be demonstrated on case studies.

Resources

Lecture Notes

Handouts (available online)

Literature

- S.M. Sze: Semiconductor Devices, Physics and Technology - W. Menz, J. Mohr, O.Paul: Microsystem Technology - Hong Xiao: Introduction to Semiconductor Manufacturing Technology - M. J. Madou: Fundamentals of Microfabrication and Nanotechnology, 3rd ed. - T. M. Adams, R. A. Layton: Introductory MEMS, Fabrication and Applications

General Information

Language
English
Levels
BSC , DR , MSC
Frequency
Yearly recurring

Examination

Type
session examination
Mode
oral 20 minutes
Students registered for Microsystems I: Process Technology and Integration (151-0621-00) (MS I) course can voluntary participate in an interim examination which would count only as a bonus to the final grade of the MSI oral examination. This interim exam is written and graded and will contain assignments/problems from the selected parts of MSI lectures and tutorials presented until the day of the examination. Obtaining 80-100% of points at the interim exam improves the student’s grade at the final oral exam by max. 0.25 grades. The maximum grade (6.0) can also be achieved exclusively by the oral exam performance itself without resorting to the bonus from the interim exam. The interim exam will take 1 hour. The date and time of the interim exam will be noticed to students by the lecturer. No auxiliary means are allowed. Any behavior during the exam which violates the ETH ethical codex will result in both the loss of bonus points but also the application of standard disciplinary measures. The material tested in the oral exam (and in the optional interim exam) is fully covered by the lectures and tutorials of the respective semester, as well as the online distributed handouts of the lectures and tutorials (presentation slides in pdf format). The recommended additional books or articles, as well as videos or lecture recordings, are only intended to deepen the understanding of the subject matter.

Course Components

Type Title Time & Place Hours
lecture Microsystems I: Process Technology and Integration
The lecture starts in the first week of the semeste.
  • Thu 13:15-16:00 (HG E 5)
  • 18.09 Date 13:15-16:00 (HG E 5)
3 h weekly
exercise Microsystems I: Process Technology and Integration
The exercise starts in the second week of the semester.
  • Tue 16:15-18:00 (HG E 1.2)
  • 23.09 Date 16:15-18:00 (HG E 1.2)
2 h weekly

Offered In