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227-0118-00L 4 Credits
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Micro Systems Technology

Microsystems Technology

Lecturers & Examiners: Prof. em. Dr. Henry Baltes, Prof. Dr. Christofer Hierold
VVZ CR n/a

Last Updated: 2026-02-05 14:57:29

Objective

Students are introduced to the basics of micromachining and silicon process technology and will understand the fabrication of microsystem devices by the combination of unit process steps ( = process flow).

Content

- Introduction to microsystems technology (MST) and micro electro mechanical systems (MEMS) - Basic silicon technologies: Thermal oxidation, photolithography and etching, diffusion and ion implantation, thin film deposition. - Specific microsystems technologies: Bulk and surface micromachining, dry and wet etching, isotropic and anisotropic etching, beam and membrane formation, wafer bonding, thin film mechanical and thermal properties, piezoelectric and piezoresitive materials. - Selected microsystems: Mechanical sensors and actuators, microresonators, thermal sensors and actuators, system integration and encapsulation.

Resources

Lecture Notes

Handouts

Literature

- S.M. Sze: Semiconductor Devices, Physics and Technology. - W. Menz, J. Mohr, O. Paul: Microsystem Technology. - G. Kovacs: Micromachined Transducer Sourcebook.

General Information

Language
English
Frequency
Yearly recurring

Examination

Type
session examination
Mode
oral 30 minutes

Course Components

Type Title Time & Place Hours
lecture with exercise Microsystems Technology
  • Mon 13:15-17:00 (ETZ E 8)
4 h weekly

Offered In